Research Themes
Semiconductor and Electronics Packaging
Research interests include multi-physics multi-scale simulation of the 3D integrated packaging and AI/ML-based Digital Twin implementation. Dr. Ryu serves an Associate Director of Packaging Research in Electronic Energy Systems (PREES) Laboratory, NCSU.
Current and Past Projects
a. 3DHI Power electronics on glass substrates
b. Thermo-mechanical reliability analysis
Smart Materials
Research interests include is an in-situ characterization method based on the X-ray photon correlation spectroscopy (XPCS) for mesoscale dynamics in ferroelectric materials.
Current and Past Projects
a. Relaxor – PT material in-situ characterization
Advanced Manufacturing
Research interests include nanoink printing for flexible electronics, nanoimprinting for metamaterials, and viscoelasticity-induced 3D micro-/nano-fabrication for multifunctional flexible films. Dr. Ryu is also affiliated with The Center for Additive Manufacturing and Logistics (CAMAL) of NCSU.
Current and Past Projects
a. Nanoink printing and sintering
b. Nanoimprinting
d. Viscoelastic instability-induced surface morphology modification
Multifunctional Nanocomposites
Research interests include multifunctional composites for photoacoustic transducers, metasurfaces, and electromagnetic device applications.
Current and Past Projects
a. Photoacoustics
b. Mid-wavelength Infrared metasurfaces
c. EM applications
Sponsors and Collaborators
Current Open Positions
1. Data analytics for image processing
Required skills: Python, Statistics, Image processing
A single experiment run yields thousands of X-ray scattering images, and our objective is to employ Python for processing these images. We will utilize the correlation function to mathematically articulate the relationships between these images. Employing Python for statistical analysis will help unveil the distribution characteristics of the correlation function, providing insights into the atomic-scale dynamics of the material being studied.
2. Multiphysics simulation for electronics packaging analysis
Required skills: LT-SPICE, Cadence, COMSOL, ANSYS
3. 3D printing with ISRU Lunar simulant
Required skills: Solidworks, Mechanical testing, 3D printing
4. Functional nanocomposite film with microtopography
Required skills: Nanocomposite fabrication, CFD (OpenFOAM)