Invited Talks and Lectures

1. Carbon Fiber Reinforced Polymer

This 1-hour lecture provides an overview of carbon fiber-reinforced polymers (CFRPs), covering their materials, manufacturing processes, and engineering applications. It introduces the fundamental mechanics of composite materials, with particular emphasis on how fiber orientation and material architecture influence the mechanical properties and structural performance of CFRPs.

2. AI Revolution and Semiconductor Packaging

This 12-hour introductory-level course provides a comprehensive introduction to the semiconductor industry and advanced packaging technologies in the AI era. It covers semiconductor fundamentals and key manufacturing processes, including Front-End-of-Line (FEOL), Back-End-of-Line (BEOL), and Post-BEOL technologies. The course highlights the growing importance of semiconductor packaging for emerging applications such as AI and electric vehicles, and introduces key Level 1 packaging technologies, including flip-chip and bumping processes. It also discusses global semiconductor industry trends and policies to provide a broader understanding of the semiconductor ecosystem.

3. Advanced Packaging Technology and Reliability

This 12-hour intermediate course provides an in-depth overview of modern semiconductor packaging technologies, including fan-in/fan-out wafer-level packaging, panel-level packaging, 2D/2.5D/3D integration, HBM, hybrid bonding, and heterogeneous integration. The course also covers key reliability considerations and analysis methods, with emphasis on the technical principles and emerging trends in advanced packaging.